HONG KONG & SAN FRANCISCO--(BUSINESS WIRE)--LFX, an offshoot of Li & Fung, today launched UNIFi3D, a 3D-as-a-Service company that helps brands accelerate their digital transformation. Idy Lee, ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
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